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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

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Brand Name : Ziitek

Model Number : TIE380-45

Certification : RoHS

Place of Origin : China

MOQ : 5kg

Payment Terms : T/T

Delivery Time : 3-8 work days

Packaging Details : 1kg/can

Products name : Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Feature : heat cured epoxy adhesive

Usage : bonding two parts of electronics

Hardness : 92 Shore A

Chemical type : epoxy

Keywords : Thermal Epoxy Glue

Thermal conductivity : 4.5W/m-K

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4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics

Product Summary:

TIE™380-45 is a one component, heat cured epoxy adhesive. It has excellent thermal conductivity and bond strength.

TIE™380-45 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

TIE380-45-TDS_EN_REV01.4 (1).pdf

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Feature

> Good thermal conductivity: 4.5W/mK

> Good maneuverability andadhesion performance

> Low shrinkage

> Low viscosity, easy-to-gas emissions

> Good solvent resistance, water resistance

> Longer working hours

> Excellent resistance to thermal shock

Typical Properties of TIETM380-45

Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2900psi *****
Thermal Conductivity 4.5W/m-K ASTM D5470

Application Features:TIE™380-45

Color Gray

Viscosity@25℃ 150,000 cPs

Specific Gravity@25℃ 2.2 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 4 Hours

125℃ 2 Hour

150℃ 30 Minutes

170℃ 5 Minutes

General package:

1kg/can

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation

Company profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.


Product Tags:

heat resistant epoxy glue

      

thermally conductive potting epoxy

      

4.5W/MK Thermal Epoxy Glue

      
Quality Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation for sale

Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation Images

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