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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

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Dongguan Ziitek Electronical Material and Technology Ltd.

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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

Name: 45mm 50 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules
Brand: Ziitek
Price: 0.1 USD

Quality 4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules for sale

Brand Name : Ziitek

Model Number : TIF1180-30-06UF thermal pad

Certification : ISO9001

Place of Origin : China

MOQ : 1000 pcs

Price : 0.1-10 USD/PCS

Payment Terms : T/T

Supply Ability : 100000pcs/month

Delivery Time : 3-8 work days

Packaging Details : 25*24*13cm canton

keyword : thermal gap pad

Specific gravity : 3.0 g/cc

material : silicone

Volume Resistivity : 2.3*1013 Ohm-cm

Name : 5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules

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5.0 MHz Moldability for Complex Parts Heat Sink Pad for Memory Modules

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

TIF100-30-06UF-Series-Datasheet-.pdf

Ziitek TIF1180-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

<Good thermal conductive:3.0 W/mK

<Thickness: 4.5mmT

<Hardness:75±5 Shore 00

<Colour: White

<Naturally tacky needing no further adhesive coating
<Available in varies thicknesses
<Broad range of hardnesses available

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1180-30-06UF
Product Name	TIF1180-30-06UF Series
Colour	White
Construction & Compostion	Ceramic filled silicone elastomer
Specific gravity	3.0 g/cc
Thickness	4.5mmT
Hardness	75±5 Shore 00
Dielectric constant@1MHz	5.0 MHz
Continuos Use Temp	-40 to 160℃
Dielectric Breakdown Voltage	>5500 VAC
Thermal conductivity	3.0 W/mK
Volume Resistivity	2.3*10^{13 _Ohm-cm}

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

FAQ

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules

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4.5mm 5.0 Mhz Silicone Thermal Heatsink Insulator Pads For Memory Modules Images