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Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

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Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

Name: Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED
Brand: Ziitek
Price: 1 USD

Quality Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED for sale

Brand Name : Ziitek

Model Number : TIG780-20

Certification : RoHS

Place of Origin : China

MOQ : 5kg

Price : USD 1-100/KG

Payment Terms : TT

Supply Ability : 10000KG/month

Delivery Time : 3-5 work days

Packaging Details : 1kg/can

Keywords : Thermal gel putty

Application : Microprocessors and LED

Thermal conductivity : 2.0W/mK

Material : Metal oxide filled silicone oil

Color : White

Name : High Quality Thermally Conductive thermal gel putty

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High Quality Thermally Conductive thermal gel putty

The TIG™780-20 is environmentally safe silicone-based thermal grease designed to solve overheating and reliability issues.

The TIG™780-20 is a heat conducting product in the shape of paste.They serve to moisten the contact surface sufficiently so as to form an interface of extremely low thermal impedance.Consequently, the heat dissipation efficiency is far superior to that offered by others.

TIG780-20-Series-Datasheet.pdf

Features

> Good thermal conductivity
> Non-toxic and environmentally safe

> Excellent long term stability
> Thoroughly wets out contact surfaces to create low thermal resistance

Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

Applications

> Semiconductor cases and heat sinks
> Chipsets and Graphic processing
> CPU's and GPU's
> Automatic dispensing and screen-printing

Typical Properties of TIG™780-20 Series
ProductName	TIG^TM780-20	Test Method
Color	White	Visual
Construction & Compostion	Metal oxide filled silicone oil	******
Density	3.0 g/cm3	ASTM D297
Thermal Conductivity	2.0 W/mK	ASTM D5470
Thermal lmpedance@10psi	0.090 ℃*in²/W	ASTM D5470
Thermal lmpedance@50psi	0.055 ℃*in²/W	ASTM D5470
Viscosity	400 Pa.s	GB/T 10247

Package:

Packing specification 0.5kg,1kg, 2kg; For other specifications, please contact us.

Storage:
Store from 18°Cto 25° C with a maximum humidity of 70%. Do not store in freezer or refigerator below 0° C. Safe disposal method does not require special protection. The storage condition is low temperature and dry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

Company profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

Advanced Thermal Gel Putty for Optimal Heat Dissipation in Microprocessors and LED

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