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Dongguan Ziitek Electronical Material and Technology Ltd.
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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

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High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

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Brand Name : Ziitek

Model Number : TIE™380-25

Certification : RoHS

Place of Origin : China

MOQ : 10kg

Price : 1-100USD/kg

Payment Terms : T/T

Supply Ability : 10000kg/month

Delivery Time : 3-8 work days

Packaging Details : 1kg/can

Products name : High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound

Material : Epoxy glue

Usage : bonding electronics

Appearance sured : Dull Gray Solid

Continuous use temp : -40 to 180℃

Thermal conductivity : 2.5 W/mK

Keywords : Thermal Epoxy Glue

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High Performance One Component Thermal Conductivity Epoxy Glue for electronic potting compound

Product Summary:

TIETM380-25 is a one component, heat cured epoxy adhesive. lt has excellent thermal conductivity and bond strength.

TIETM380-25 is a good choice for high speed production lines because it has the rheology to allow stencil printing and a fast, one component, heat cure.

Spec-of-TIE380-25.pdf

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Feature

> Outstanding thermal performance 2.5W/mK
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized
> Fiberglass reinforced for puncture, shear and tear resistance
> Easy release construction

Applications

> Waterproof LED Power
> SMD LED module
> LED Flesible strip, LED bar
> LED Panel Light
> LED floor light
> Routers

Typical Properties of TIETM380-25

Chemical type Epoxy Test Method
Appearance uncured Gray Paste Visual
Appearance cured Dull Gray Solid Visual
Components One Component *****
Heat Capacity 0.7 l/g-K ASTM C351
Key Substrates Metals, ceramics *****
Hardness 92 Shore A ASTM 2240
Continuous Use Temp -40 to 180℃ *****
Tensile strength Al/Al @25°C >2800psi *****
Thermal Conductivity 2.5 W/m-K ASTM D5470
Packing details

1kg/can

*****

Application Features:TIE™380-25

Color Gray

Viscosity@25℃ 140,000 cPs

Specific Gravity@25℃ 2.1 g/cc

Shelf life @25℃° 10 Days

@0℃° 6 Months

(Storage methods and temperature will affect the shelf life)

Curing procedures:

Curing temperature Curing time

100℃° 3 Hours

125℃ 1.5 Hour

150℃ 20 Minutes

170℃ 5 Minutes

Company profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.


Product Tags:

One Component Thermal Epoxy Glue

      

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High Performance Thermal Epoxy Glue

      
Quality High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound for sale

High Performance One Component Thermal Conductivity Epoxy Glue For Electronic Potting Compound Images

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